NDLI: A nonlinear thermal stress analysis of surface mount solder joints

Content Provider	IEEE Xplore Digital Library
Author	Ozmat, B.
Copyright Year	1990
Description	Author affiliation: Texas Instrum., Dallas, TX, USA (Ozmat, B.)
Abstract	A set of nonlinear finite-element (FE) cyclic thermal stress analyses of leaded ceramic chip carriers (LCCC) was performed. The FE models included the geometric and elastic compliance effects associated with the LCCC cavity, Kovar lid, copper solder pads and thermal joints, the orthotropic printed wiring board (PWB), and a constraining thermal core. The effect of nonlinear and rate-dependent constitutive characteristics of the solder alloy on the distribution of cyclic stress, strain, and energy-dissipation behavior was studied. It is shown that the inclusion of rate effects in the material behavior has a paramount effect on the stress, strain, and energy-dissipation predictions. The difference is due to the creep relaxation leading to redistribution of the load, which was not predicted by an elastic-plastic material model alone. Acceleration factors were calculated from the results of analyses performed for an accelerated thermal test cycle case and a specific real-life thermal cycle case.<>
Starting Page	959
Ending Page	972
File Size	1132915
Page Count	14
File Format	PDF
DOI	10.1109/ECTC.1990.122305
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-05-20
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal stresses Soldering Iron Performance analysis Lead Capacitive sensors Life estimation Thermal factors Finite element methods Ceramics
Content Type	Text
Resource Type	Article

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