NDLI: Signal integrity analysis of high-speed, high-pin-count digital packages

Content Provider	IEEE Xplore Digital Library
Author	Tsai, C.-T.
Copyright Year	1990
Description	Author affiliation: Motorola Semicond. Products Sect., Chandler, AZ, USA (Tsai, C.-T.)
Abstract	A transmission-line model of package traces in conjunction with a lattice diagram technique is used to study the signal integrity problem in digital systems using high-speed, high-pin-count packages. Formulae which predict the signal degradations, including overshoot/undershoot and edge-rate degradation, are presented for two different high-speed digital system interconnect schemes (parallel termination and series termination) at different locations of the interconnect (output, input, package-board junction, etc.) Among different degradations at various places on the interconnect, the one of most concern to system designers is the reflection noise in multiple fanouts or bidirectional buffers. An experimental procedure was developed to verify this problem and to quantitatively measure the magnitude of the reflection noise. An experimental 288-PGA (pin-grid-array) package which may represent the current package technology was chosen for this experiment. The results clearly indicate that package parasitics can substantially affect the signal integrity of current high-speed digital systems. According to the present study, it is not possible to choose a single package impedance Z/sub p/ which can give optimized signal response everywhere along the interconnect. It may be a design tradeoff to choose a particular package impedance for a specific system. However, the study also indicates that choosing a package impedance is far less important that minimizing the package delay.<>
Starting Page	1098
Ending Page	1107
File Size	997435
Page Count	10
File Format	PDF
DOI	10.1109/ECTC.1990.122322
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-05-20
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Signal analysis Packaging Digital systems Degradation Impedance Acoustic reflection Transmission lines Lattices Signal design Noise measurement
Content Type	Text
Resource Type	Article

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