NDLI: Effect of combination between various polyimide coating materials and molding compounds on the reliability of integrated circuits (ICs)

Content Provider	IEEE Xplore Digital Library
Author	Takeuchi, E. Takeda, T. Hirano, T.
Copyright Year	1990
Description	Author affiliation: Sumitomo Bakelite Co. Ltd., Kanagawa, Japan (Takeuchi, E.; Takeda, T.; Hirano, T.)
Abstract	Various polyimide coatings used on integrated circuits (ICs) were investigated for crack and molding compound interface separation caused by heat stress. As factors influencing the occurrence of cracking or delamination, the authors examined heat resistance, mechanical properties, moisture absorption, and adhesion strength to the silicon wafer or molding compound of four polyimide resins, both photosensitive and non-photosensitive. The crack occurrence and interface adhesion properties of conventional IC packaging containing polyimide-coated chips and an epoxy molding compound were also investigated. It was found that every polyimide studied had good adhesion strength to silicon wafers and to the molding compound and that the coating of IC chips with polyimides reduced package cracking considerably. However, there were some differences in properties among these polyimide types; the ester-type photosensitive polyimide resin had very poor mechanical properties and large internal stress.<>
Starting Page	818
Ending Page	823
File Size	465258
Page Count	6
File Format	PDF
DOI	10.1109/ECTC.1990.122284
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-05-20
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polyimides Coatings Mechanical factors Adhesives Silicon Resins Integrated circuit packaging Stress Delamination Resistance heating
Content Type	Text
Resource Type	Article

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