NDLI: Flip-chip solder bump fatigue life enhanced by polymer encapsulation

Content Provider	IEEE Xplore Digital Library
Author	Suryanarayana, D. Hsiao, R. Gall, T.P. McCreary, J.M.
Copyright Year	1990
Description	Author affiliation: IBM Corp., Endicott, NY, USA (Suryanarayana, D.; Hsiao, R.; Gall, T.P.; McCreary, J.M.)
Abstract	Encapsulation of controlled collapse chip connection (C4) joints, using a filled epoxy resin having a matched coefficient of thermal expansion (CTE), has provided a substantial increase in the life of C4 joints in accelerated thermal cycle (ATC) fatigue testing on both low-CTE organic and ceramic chip carriers. The C4 joints are encapsulated by dispensing a bead of resin along an edge of the chip. The encapsulation flows underneath the chip by capillary action and completely fills the gap between the chip and the substrate. Optimization of the filler size distribution and resin rheology to get consistent flow under the chip without any bubbles is discussed. The filler size distribution and flow under the chip are shown to cross sections of several different materials including low-alpha-emitting encapsulants for memory applications. Novel encapsulant formulations were tested by videotaping the flow of encapsulant under transparent quartz chips. The formation of bubbles as the encapsulant flows around the C4 joints and irregularities in the surface of the substrate can clearly be seen. Proper C4 encapsulation provides virtually complete coverage around all C4 connections. C4 life testing over various temperature ranges show a 5 to 10 times improvement for both memory and logic footprints when the C4 joints are encapsulated. The vast improvement in C4-joint reliability provided by encapsulation allows the C4 technology to be extended to much larger chips or to higher service-temperature ranges without conventional DNP (distance from neural point) constraints.<>
Starting Page	338
Ending Page	344
File Size	761585
Page Count	7
File Format	PDF
DOI	10.1109/ECTC.1990.122212
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-05-20
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fatigue Polymers Encapsulation Thermal expansion Life testing Epoxy resins Life estimation Ceramics Rheology Temperature distribution
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Enhancement of flip-chip fatigue life by encapsulation

Reflow-curable polymer fluxes for flip chip encapsulation

Reliability of Flip Chip Solder Bump Joints

Effect of integrated heat spreader on thermal performance and bump joint reliability for flip chip packages

High Reliability Flip Chip Using Low CTE Laminate Substrates

Reflow-curable polymer fluxes for flip chip encapsulation

Flip-chip encapsulation on ceramic substrates

Repairability of underfill encapsulated flip-chip packages

Dependence of Flip Chip Solder Reliability on Filler Settling

Flip-chip solder bump fatigue life enhanced by polymer encapsulation

Similar Documents

Enhancement of flip-chip fatigue life by encapsulation

Reflow-curable polymer fluxes for flip chip encapsulation

Reliability of Flip Chip Solder Bump Joints

Effect of integrated heat spreader on thermal performance and bump joint reliability for flip chip packages

High Reliability Flip Chip Using Low CTE Laminate Substrates

Reflow-curable polymer fluxes for flip chip encapsulation

Flip-chip encapsulation on ceramic substrates

Repairability of underfill encapsulated flip-chip packages

Dependence of Flip Chip Solder Reliability on Filler Settling

Flip-chip solder bump fatigue life enhanced by polymer encapsulation