NDLI: A high throughput optoelectronic module assembly process

Content Provider	IEEE Xplore Digital Library
Author	Schwab, P. Bowen, T. Perko, R. Delen, N. Goodrich, J. Anderson, R.
Copyright Year	2004
Description	Author affiliation: Tyco Electron. Inc., Harrisburg, PA, USA (Schwab, P.; Bowen, T.; Perko, R.; Delen, N.)
Abstract	The throughput of die bonding machines, required to provide precise assembly alignment, is inversely and exponentially proportional to the accuracy required. Optoelectronic throughputs are much lower than pick and place assembly system throughputs due to the required alignment accuracy. This paper presents a technique for closing the gap in the assembly speed using passive alignment. The idea is to fabricate a silicon optical bench (SiOB) substrate where the semiconductors can be placed and tacked, utilizing conventional high speed placement equipment. The devices then passively align themselves into a highly accurate position during a subsequent batch reflow process. The SiOB substrate is aligned to the fiber core with the strategic use of crystal lattice etching techniques which provide both X and Y orientation of the components to the fiber. A second phase of this project is to take the SiOB substrate and attach it to a ferrule in a manner in which the ferrule is self aligned to the laser. By doing this, the device becomes an integral part of a connectorized unit. This is then the foundation for an active device module (ADM).
Starting Page	1475
Ending Page	1478
File Size	355489
Page Count	4
File Format	PDF
ISBN	0780383656
DOI	10.1109/ECTC.2004.1320309
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-04
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Throughput Substrates Optical fiber devices Microassembly Assembly systems Silicon High speed optical techniques Lattices Etching Fiber lasers
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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