NDLI: Conductivity improvement of isotropic conductive adhesives with short-chain dicarboxylic acids

Content Provider	IEEE Xplore Digital Library
Author	Yi Li Kyoung-sik Moon Haiying Li Wong, C.P.
Copyright Year	2004
Description	Author affiliation: Sch. of Mater. Sci. & Eng. & Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA (Yi Li; Kyoung-sik Moon; Haiying Li; Wong, C.P.)
Abstract	With the phasing out of lead-bearing solders, electrically conductive adhesives (ECAs) have been identified as an environmentally friendly alternative to tin/lead (Sn/Pb) solders in electronics packaging applications. Compared to Sn/Pb solders, conductive adhesive technology offers numerous advantages. However, as a new technology, conductive adhesive technology still has many concerns and limitations. In order for conductive adhesive technology to achieve universal acceptance, ECAs with better properties must be developed. The purpose of this study is to increase the conductivity of conductive adhesives by using short chain dicarboxylic acids, since such acids can partially remove or can completely replace the C-18 stearic acid which are commonly used as the surfactant in Ag flakes manufacturing process. Malonic acid and adipic acid, which only have single-bond short chain hydrocarbon between the dicarboxylic groups, increase the conductivity of conductive adhesives greatly. Terephthalic acid, however, deteriorates the conductivity due to the rigid aromatic structure in the molecule. The stabilized contact resistance has also been achieved with the introduction of dicarboxylic acids. Most importantly, the significant improvement of electrical properties is achieved without adversely affecting the physical and mechanical properties of the ICAs.
Starting Page	1959
Ending Page	1964
File Size	443557
Page Count	6
File Format	PDF
ISBN	0780383656
DOI	10.1109/ECTC.2004.1320395
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-04
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Conductivity Conductive adhesives Lead Tin Mechanical factors Electronics packaging Manufacturing processes Hydrocarbons Contact resistance Independent component analysis
Content Type	Text
Resource Type	Article

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