NDLI: Vibration-induced solder joint failure of a Ceramic Column Grid Array (CCGA) package

Content Provider	IEEE Xplore Digital Library
Author	Perkins, A. Sitaraman, S.K.
Copyright Year	2004
Description	Author affiliation: Comput. Aided Simulation for Package Reliability Lab., Georgia Inst. of Technol., Atlanta, GA, USA (Perkins, A.; Sitaraman, S.K.)
Abstract	Vibration analysis is important for electronic packages used in automotive, military, and other applications. For a high-I/O area-array package such as the Ceramic Column Grid Array (CCGA) package, the package can have a significant effect on the vibration characteristics of the system, which will in turn affect the solder joint fatigue life. The effect of solder joint stiffness and CCGA package mass on the natural frequency and mode shapes is investigated in this paper. The objective is to develop an experimental and a modeling approach that can accurately determine the solder joint behavior of electronic components under vibration conditions. In particular, this paper discusses the out-of-plane sinusoidal vibration experiments at 1G, 3G, 5G, and 10G, the analytical modeling, and the numerical modeling for a 42.5mm /spl times/ 42.5mm /spl times/ 4mm 1089 I/O CCGA package on a 133 mm /spl times/ 61 mm /spl times/ 2.8 mm FR4 board.
Starting Page	1271
Ending Page	1278
File Size	637852
Page Count	8
File Format	PDF
ISBN	0780383656
DOI	10.1109/ECTC.2004.1320277
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-04
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Ceramics Electronics packaging Numerical models Automotive engineering Fatigue Frequency Shape Electronic components Analytical models
Content Type	Text
Resource Type	Article

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