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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Doyle, M.S. |
| Copyright Year | 2004 |
| Description | Author affiliation: IBM Corp., Rochester, MN, USA (Doyle, M.S.) |
| Abstract | Signal integrity analysis is largely neglected in flexible circuit design. Referred to as "cables," ribbons or discrete connections, minimal, if any, analysis is typically performed. However, due to their ability to successfully address mechanical flexibility and cost constraints, flexible circuits have become increasingly appealing solutions for high-speed, controlled impedance interconnect. Design for signal integrity, characteristic impedance and attenuation control are critical to successfully placing flexible circuits in the highspeed market at GHz frequencies. This paper addresses the following: (1) mesh reference plane impedance prediction using solid plane techniques; (2) characteristic impedance variations caused by inconsistent orientation to reference planes; (3) uneven adhesive distribution in mesh reference constructs; (4) cross-talk resulting from signal-to-mesh orientation and dielectric separation; (5) material alternatives to lower dielectric loss in high-speed applications. |
| Starting Page | 1788 |
| Ending Page | 1795 |
| File Size | 877673 |
| Page Count | 8 |
| File Format | |
| ISBN | 0780383656 |
| DOI | 10.1109/ECTC.2004.1320361 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2004-06-04 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Impedance Coupling circuits Circuit noise Flexible printed circuits Dielectric losses Crosstalk Circuit analysis Signal analysis Circuit synthesis Cables |
| Content Type | Text |
| Resource Type | Article |
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