NDLI: Effect of thermal aging on board level drop reliability for Pb-free BGA packages

Content Provider	IEEE Xplore Digital Library
Author	Tz-Cheng Chiu Kejun Zeng Stierman, R. Edwards, D. Ano, K.
Copyright Year	2004
Description	Author affiliation: Texas Instrum. Inc., Dallas, TX, USA (Tz-Cheng Chiu; Kejun Zeng; Stierman, R.)
Abstract	The drive for Pb-free solders in the microelectronics industry presents several new reliability challenges. Examples include package compatibility with higher process temperatures, new solder compound failure mechanisms, and the selection of the proper Pb-free alloy to maximize product lifetime. In addition to the challenges posed by the Pb-free material conversion, the migration of market focus from desktop computing to portable applications is changing the critical system failure mode of interest from conventional temperature cycling (T/C) induced solder fatigue opens to drop impact induced solder joint fracture. In this paper a study was conducted to investigate the influence of intermetallic compound (IMC) growth on the solder joint reliability of Pb-free ball grid array (BGA) packages under drop loading conditions. Thermal aging at homologous temperatures between 0.76 and 0.91 with microstructural analysis was conducted to analyze the solid phase IMC growth at the solder to BGA pad interface. Component level,ball shear and pull tests were also conducted to investigate the aging effect on solder joint strength. A key finding from this work is that Kirkendall voids formed at the bulk solder to package bare Cu pad interface under relative low 100/spl deg/C aging. Void formation and coalesce is shown to be the dominant mechanism for solder joint strength and board level drop reliability degradation.
Starting Page	1256
Ending Page	1262
File Size	768866
Page Count	7
File Format	PDF
ISBN	0780383656
DOI	10.1109/ECTC.2004.1320275
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-04
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Aging Packaging Soldering Temperature Microelectronics Failure analysis Conducting materials Joining materials Computer applications Portable computers
Content Type	Text
Resource Type	Article

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