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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Tahui Wang Tse-En Chang Chimoon Huang |
| Copyright Year | 1994 |
| Description | Author affiliation: Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan (Tahui Wang; Tse-En Chang) |
| Abstract | An interface trap-assisted tunneling and thermionic emission model has been developed to study an increased drain leakage current in off-state MOSFET's after hot carrier stress. In the model, a complete band-trap-band leakage path is formed at the Si-SiO/sub 2/ interface by hole emission from interface traps to the valence band and electron emission from interface traps to the conduction band. Both hole and electron emissions are carried out via quantum tunneling or thermal excitation. In experiment, a 0.5 /spl mu/m n-MOSFET was subject to hot carrier stress to generate interface traps. The drain leakage current was characterized to compare with the model. Our study reveals that the interface trap-assisted two-step tunneling, hole tunneling followed by electron tunneling, is responsible for the leakage current at a large drain-to-gate bias (V/sub dg/) The lateral field plays a dominant role in the two-step tunneling process. As V/sub dg/ decreases, a thermionic-field emission mechanism, hole thermionic emission and electron tunneling, becomes a primary leakage path. At a sufficiently low V/sub dg/, our model reduces to the Shockley-Read-Hall theory and thermal generation of electron hole pairs through traps is dominant.< |
| Starting Page | 161 |
| Ending Page | 164 |
| File Size | 326969 |
| Page Count | 4 |
| File Format | |
| ISBN | 0780321111 |
| ISSN | 01631918 |
| DOI | 10.1109/IEDM.1994.383440 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1994-12-11 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermionic emission MOSFET circuits Tunneling Electron traps Charge carrier processes Leakage current Electron emission Hot carriers Thermal stresses Thermal conductivity |
| Content Type | Text |
| Resource Type | Article |
| Subject | Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering |
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