NDLI: Non-uniform micro-channel design for stacked 3D-ICs

Content Provider	IEEE Xplore Digital Library
Author	Bing Shi Srivastava, A. Peng Wang
Copyright Year	2011
Description	Author affiliation: University of Maryland, College Park, USA (Bing Shi; Srivastava, A.; Peng Wang)
Abstract	Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with micro-channels. This approach, though might provide sufficient cooling, requires quite high pumping power. In this paper, we investigate the non-uniform allocation of micro-channels to provide sufficient cooling with less pumping power. Specifically, we decide the count, location and pumping pressure drop/flow rate of micro-channels such that acceptable cooling is achieved at minimum pumping power. Thermal wake effect and runtime pressure drop/flow rate control are also considered. The experiments showed that, compared with the conventional design which spreads micro-channels all over the chip, our non-uniform micro-channel design achieves 55–60% pumping power saving.
Starting Page	658
Ending Page	663
File Size	522611
Page Count	6
File Format	PDF
ISBN	9781450306362
ISSN	85644924
e-ISBN	9781450306362
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-06-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Association for Computing Machinery, Inc. (ACM)
Subject Keyword	Cooling Three dimensional displays Heating Thermal resistance Resource management Runtime Benchmark testing power 3D-IC micro-channel liquid cooling
Content Type	Text
Resource Type	Article

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