NDLI: High-throughput electron beam direct writing of VIA layers by character projection using character sets based on one-dimensional VIA arrays with area-efficient stencil design

Content Provider	IEEE Xplore Digital Library
Author	Ikeno, R. Maruyama, T. Iizuka, T. Komatsu, S. Ikeda, M. Asada, K.
Copyright Year	2013
Description	Author affiliation: e-Shuttle, Inc., Japan (Maruyama, T.) \|\| Dept. of Electr. Eng. & Inf. Syst., Univ. of Tokyo, Tokyo, Japan (Iizuka, T.) \|\| VLSI Design & Educ. Center (VDEC), Univ. of Tokyo, Tokyo, Japan (Ikeno, R.; Komatsu, S.; Ikeda, M.; Asada, K.)
Abstract	Character projection (CP) is a high-speed mask-less exposure technique for electron-beam direct writing (EBDW). In CP exposure of VIA layers, higher throughput is realized if more VIAs are exposed in each EB shot, but it will result in huge number of VIA characters required for arbitrary VIA placement. We adopt one-dimensional VIA array as the basic CP character architecture to increase VIA numbers in an EB shot while saving the stencil area by superposed character arrangement. CP throughput is further improved by layout constraints for VIA placement in detail routing phase. Our experimental results give estimated EB shot counts less than 174G shot/wafer in 14nm technologies.
Starting Page	255
Ending Page	260
File Size	185896
Page Count	6
File Format	PDF
ISBN	9781467330299
ISSN	21536961
e-ISBN	9781467330305
DOI	10.1109/ASPDAC.2013.6509605
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-01-22
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Layout Encoding Computer architecture Microprocessors Throughput Routing Apertures
Content Type	Text
Resource Type	Article

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