NDLI: Lithography challenges and solutions for MEMS/LED/ABS applications

Content Provider	IEEE Xplore Digital Library
Author	Khorram, H.R. Fukui, J. Hagiwara, S. Mizoroke, S. Osanai, M. Onuki, T. Berghof, V.
Copyright Year	2012
Description	Author affiliation: Nikon Engineering Co. LTD Yokohama-city, Japan (Fukui, J.; Hagiwara, S.; Mizoroke, S.; Osanai, M.; Onuki, T.) \|\| First Sensor AG, Peter - Behrens Strasse 15, Berlin, Germany (Berghof, V.) \|\| Nikon Precision Inc. Belmont, USA (Khorram, H.R.)
Abstract	Similar to IC manufacturing, Cost of Ownership (CoO) and enhanced productivity are key focus areas for Microelectromechanical Systems (MEMS), Light Emitting Diodes (LED) and Air Bearing Surface (ABS) manufacturers. Here also, cost reduction can be achieved by incorporating more devices on a single wafer, increasing the wafer size, through yield improvements, as well as by reducing maintenance and operating costs. The lithography tools must provide sufficient resolution to satisfy imaging requirements, but it is imperative that they also deliver large depth of focus (DoF) and field-by-field focusing capabilities to achieve the desire CD fidelity. In addition to robust imaging and focusing capabilities the lithography tools must also provide sufficient overlay capabilities to overcome process challenges unique to MEMS/LED/ABS technologies. The scope of this work will be limited to the photolithography challenges associated with MEMS/LED/ABS manufacturing.
Starting Page	315
Ending Page	320
File Size	4093726
Page Count	6
File Format	PDF
ISBN	9781467303507
ISSN	10788743
e-ISBN	9781467303514
DOI	10.1109/ASMC.2012.6212919
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-05-15
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromechanical devices Lithography Light emitting diodes Substrates Approximation methods Resists DOF MEMS LED ABS IC LNA
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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