NDLI: A Silicon-Based LED Packaging Substrate With an Island Structure for Phosphor Encapsulation Shaping

Content Provider	IEEE Xplore Digital Library
Author	Yukuan Chu Chunyu Chen Chingfu Tsou
Copyright Year	2011
Abstract	This paper proposes an encapsulation shaping method for white light-emitting diode packaging, using a silicon substrate with an island structure and using a simple yttrium aluminum garnet phosphor dispensing process. The technology utilizes the interaction of the interfacial tension between silicon island structure and silicone phosphor material for encapsulation shaping at an appropriate curing temperature. Various encapsulation structures, such as hemispherical and shell-type lenses, are fabricated using different encapsulation doses, which allow specific optical requirements to be fulfilled. The experimental results show that a hemispherical encapsulation lens with a radius of curvature of 0.9 mm is formed, when the diameter of the island structure is 1.8 mm and the dispensing dose is 1.5 mL. When the dispensing doses are 2.5 and 4.0 mL, shell-type lens structures with short and long cylinders, respectively, are fabricated. In terms of optical characteristics of the shell-type structure, there is a large measured variation in chromaticity at different view angles, but for the short encapsulation cylinder the uniformity of the lighting is significantly improved. The simulation result for the luminance profile is in agreement with the experimental results.
Starting Page	155
Ending Page	162
Page Count	8
File Size	1316252
File Format	PDF
ISSN	21563950
Volume Number	5
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Encapsulation Light emitting diodes Lenses Silicon Substrates Optical device fabrication silicon substrate. Encapsulation shaping light emitting diode (LED) silicon substrate
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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