NDLI: Development of CMP pad using an unpatterned surface inspection system

Content Provider	IEEE Xplore Digital Library
Author	Cheng, C.Y. Peng, S.N. Chen, S.C. Yang, L. Hu, D. Lin, S.
Copyright Year	2012
Description	Author affiliation: Semiconductor Technologies, Dow Electronic Materials, The Dow Chemical Company, Miaoli, TAIWAN 35053, R.O.C. (Cheng, C.Y.; Peng, S.N.; Chen, S.C.) \|\| KLA-Tencor Corporation, Milpitas, USA (Yang, L.; Hu, D.; Lin, S.)
Abstract	As the device continues to shrink, copper(Cu) chemical mechanical planarization (CMP) remains a challenging process for copper dual damascene processes. In the past, the standard blanket wafer defectivity detection system for CMP processes focused on particle or scratch count and characterization. However the standard methodology is no longer suitable for detecting anomalous process defects while technology nodes continue to scale down. Accessing defectivity information below standard thresholds can be achieved by wafer haze analysis. Wafer haze information can be used in addition to standard defectivity data to optimize CMP processes and characterize CMP defects. Haze analysis represents a powerful tool for capturing spatial signatures caused by CMP processes. [1, 2] This study shows how we applied KLA-Tencor's SURFmonitor with grid analysis to reveal defect signatures not apparent in the traditional darkfield defect map. This new method of using haze analysis to measure haze defects on Cu blanket wafers was used for characterization and development of CMP pads.
Starting Page	128
Ending Page	131
File Size	1000086
Page Count	4
File Format	PDF
ISBN	9781467303507
ISSN	10788743
e-ISBN	9781467303514
DOI	10.1109/ASMC.2012.6212882
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-05-15
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Rough surfaces Surface roughness Surface treatment Standards Inspection Production Monitoring SURFmonitor CMP defectivity haze
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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