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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kholdoun Torki Bernard Courtois |
| Copyright Year | 2005 |
| Description | Author affiliation: Circuits Multi-Projects, Grenoble (Kholdoun Torki; Bernard Courtois) |
| Abstract | CMP aims at providing universities, research laboratories and industries with the possibility to have their integrated circuits projects fabricated for prototyping and low volume production. Presently, users are serviced for CMOS double layer poly/double layer metal (DLP/DLM) 0.8, DLM/TLM 0.6mu, DLP/4LM 0.35mu, SLP/6LM 0.18mu, SLP/6LM 0.13mu, SLP/7LM 90nm, BiCMOS DLP/DLM 0.8mu, SiGe 0.35mu SLP/5LM, SiGe:C 0.25mu SLP/5LM and GaAs HEMT 0.2mu. About 40 multi-project runs are offered per year. Micro electro mechanical systems (MEMS) are also provided in standard CMP runs in CMOS DLP/DLM 0.8mu 0.6mu, BiCMOS DLP/DLM 0.8mu and HEMT GaAs 0.2mu, using compatible front-side bulk micro-machining. MUMPS processes are offered as surface micro-machining allowing integrating MEMS only microstructures |
| Starting Page | 1073 |
| Ending Page | 1076 |
| File Size | 2053289 |
| Page Count | 4 |
| File Format | |
| ISBN | 0780392108 |
| DOI | 10.1109/ICASIC.2005.1611509 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2005-10-24 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Prototypes Production BiCMOS integrated circuits Gallium arsenide HEMTs Micromechanical devices Educational institutions Laboratories Textile industry Silicon germanium |
| Content Type | Text |
| Resource Type | Article |
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