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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Numata, H. Nagasawa, S. Tanaka, M. Tahara, S. |
| Copyright Year | 2002 |
| Abstract | A mechanical polishing planarization (MPP) process is developed with an endpoint detection method. MPP makes it possible to form self-aligned contacts on small junctions and to decrease parasitic inductance. It can also control the thickness of the insulation layers precisely. MPP was used to fabricate a 22 /spl mu/m/spl times/22 /spl mu/m vortex transitional memory cell and the cell operated correctly. The reliability of interlayer insulation was increased for 64-Kbit memory cell arrays fabricated using MPP. It is concluded that MPP is an effective technology for fabricating high-density Josephson circuits. |
| Sponsorship | Council on Superconductivity Appl. Superconductivity Conference Inc MIT |
| Starting Page | 3198 |
| Ending Page | 3201 |
| Page Count | 4 |
| File Size | 472650 |
| File Format | |
| ISSN | 10518223 |
| Volume Number | 9 |
| Issue Number | 2 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1999-06-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Fabrication Integrated circuit technology Programmable logic arrays Planarization Insulation Slurries Scanning electron microscopy Electrodes Sputtering Superconducting devices |
| Content Type | Text |
| Resource Type | Article |
| Subject | Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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