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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Tighe, T.S. Akerling, G. Smith, A.D. |
| Copyright Year | 2002 |
| Abstract | To meet the packaging needs of current superconducting electronics, we have developed high speed multi-chip modules (MCMs), flexible ribbon cabling and press-contact surface mounts. We describe these new technologies and include techniques for high reliability, high-yield assembly. In addition, we present electrical and thermal characterizations of a system which incorporates these new technologies. Electrical characterization includes multi-GHz insertion loss and digital-data transmission measurements. We have performed extensive thermal modeling using SINDA software and have experimentally verified these simulations. We present the results and their general applicability to these new cryogenic packaging technologies. |
| Sponsorship | Council on Superconductivity Appl. Superconductivity Conference Inc MIT |
| Starting Page | 3173 |
| Ending Page | 3176 |
| Page Count | 4 |
| File Size | 400381 |
| File Format | |
| ISSN | 10518223 |
| Volume Number | 9 |
| Issue Number | 2 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1999-06-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Cryogenics Electronics packaging Electronic packaging thermal management Superconducting cables Assembly Insertion loss Propagation losses Loss measurement Electric variables measurement Software performance |
| Content Type | Text |
| Resource Type | Article |
| Subject | Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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