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| Content Provider | IET Digital Library |
|---|---|
| Author | Kandjani, Negar Esmaeilzadeh Nurelahi, Shahriyar Tafrishi, Seyed Amir Esmaeilzadeh, Esmaeil |
| Abstract | In this work, an electronic computer chip generates a 50–150 W heat over a 40 mm × 40 mm surface, requiring dissipation of about 9.5 × 10 4 W / m 2 . The authors design a copper heat sink ( 40 mm × 40 mm × 5 mm ) that is mounted over the chip with two active methods for enhancing heat removal from the chip. To enhance the cooling effects, a laminar developing heat and fluid flow is introduced into the assumed seven miniature channels in a rectangular shape ( 2 mm × 4 mm ), which takes away heat partly. Ethylene glycol as a base fluid and ethylene glycol + Al2O3 as a nanofluid with a volume fraction of nanoparticles 0.5, 1 and 1.5% flow with laminar regimes. To remove heat from the other parts of the sink, an external airflow is used with a free stream velocity of 2 m/s over it. This airflow is a laminar two-dimensional boundary layer over the sink in the direction of its length. By numerical simulation, these two methods of cooling are investigated for enhancing heat removal from the sink. The results show cooling efficiency increased by about 8.5% in comparison with the cooling system with free convection where there is an internal cooling. |
| Starting Page | 1105 |
| Ending Page | 1110 |
| Page Count | 6 |
| Volume Number | 13 |
| e-ISSN | 17500443 |
| Issue Number | Issue 8, Aug (2018) |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/mnl/13/8 |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/10.1049/mnl.2018.0036 |
| Journal | Micro & Nano Letters |
| Publisher Date | 2018-08-01 |
| Access Restriction | Open |
| Rights Holder | © The Institution of Engineering and Technology |
| Subject Keyword | Aerodynamics Al2O3 Aluminium Compound Applied Fluid Mechanics Boundary Layer Computational Method Convection And Heat Transfer Cooling Copper Heat Sink Electronic Computer Chip Ethylene Glycol External Air Flow External Airflow Flow Simulation Flows in Ducts, Channel, And Conduits Fluid Flow Fluid Mechanics Free Convection Free Stream Velocity General Fluid Dynamics Theory Heat And Thermodynamic Processes Heat Flow Heat Removal Heat Sinks Internal Cooling Laminar Flow Laminar Flows Laminar Regimes Laminar Two-dimensional Boundary Layer Mechanical Engineering Microchannel Flow Multiphase Flows Nanofluid Nanofluidics Nanoparticle Natural Convection Numerical Simulation Power 50 W to 150.0 W Product Packaging Simulation Two-phase Flow Velocity 2.0 M/s |
| Content Type | Text |
| Resource Type | Article |
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