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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Aasmundtveit, K.E. Thi Thuy Luu Hoang-Vu Nguyen Johannessen, R. Hoivik, N. Kaiying Wang |
| Copyright Year | 2010 |
| Description | Author affiliation: Institute of Micro and Nano Systems Technology, HiVe - Vestfold University College, 3184 Borre, Norway (Aasmundtveit, K.E.; Thi Thuy Luu; Hoang-Vu Nguyen; Hoivik, N.; Kaiying Wang) || GE Vingmed Ultrasound AS, 3191 Horten, Norway (Johannessen, R.) |
| Abstract | Fluxless SLID (Solid-Liquid InterDiffusion) bonding based on Au and Sn is presented, using two different processes, and bonding temperatures in the range 300–350 °C. The decomposition of the bond was tested by applying shear force while heating the samples. No bond delamination was observed for temperatures up to 350–400 °C, with 95 % of the tested samples surviving 400 °C without bond delamination. This is more than 100 °C higher than the melting temperature of the commonly used eutectic Au-Sn bond (80 wt% Au, melting at 278 °C). The Au-Sn system is particularly interesting since it is oxidation resistant, allowing fluxless bonding. With the SLID process, the metal system is applicable for true high-temperature applications. |
| Starting Page | 1 |
| Ending Page | 6 |
| File Size | 977189 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424485536 |
| e-ISBN | 9781424485550 |
| e-ISBN | 9781424485543 |
| DOI | 10.1109/ESTC.2010.5643020 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-09-13 |
| Publisher Place | Germany |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Force Optical variables measurement Tin Copper Bonding Substrates |
| Content Type | Text |
| Resource Type | Article |
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