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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Zoberbier, R. Hennemeyer, M. Toennies, D. Kraft, A. Eisner, M. Völkel, R. |
| Copyright Year | 2010 |
| Description | Author affiliation: SUSS MicroTec Lithography, Schleissheimerstr. 90, 85748 Garching, Germany (Zoberbier, R.; Hennemeyer, M.; Toennies, D.) || DELO Industrial Adhesives, DELO-Allee 1, 86949 Windach, Germany (Kraft, A.) || SUSS MicroOptics SA, Jaquet-Droz 7, CH-2000 Neuchatel, Switzerland (Eisner, M.; Völkel, R.) |
| Abstract | For many years digital cameras have been integrated into mobile phones. In the beginning the camera phone was just another gimmick with limited value to the end user. Today, imaging is considered as a core feature by the user and major mobile phone manufacturers and most mobile phones are equipped with two cameras, a primary Mega-Pixel (MPx1) camera for photography and a secondary CIF or VGA camera for video calls. Far more than a billion mobile phone cameras were sold in 2009, and the numbers are still increasing rapidly. The increasing demand for more functions and features coming along with cost reduction plays a significant role in today's product design and manufacturing technologies of mobile phones and pushes the industry to continuously improve the performance and the manufacturing technologies. |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 1303411 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424485536 |
| e-ISBN | 9781424485550 |
| e-ISBN | 9781424485543 |
| DOI | 10.1109/ESTC.2010.5642921 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-09-13 |
| Publisher Place | Germany |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Semiconductor device reliability Cameras CMOS integrated circuits Delamination Lenses |
| Content Type | Text |
| Resource Type | Article |
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