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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Gieser, H.A. Bonfert, D. Hengelmann, H. Wolf, H. Bock, K. Zollmer, V. Werner, C. Domann, G. Bahr, J. Ndip, I. Curran, B. Oehler, F. Milosiu, H. |
| Copyright Year | 2010 |
| Description | Author affiliation: Fraunhofer IZM-Mm Hansastr. 27d, 80686 Munich, Germany (Gieser, H.A.; Bonfert, D.; Hengelmann, H.; Wolf, H.; Bock, K.) || ISC, Hansastr. 27d, 80686 Munich, Germany (Domann, G.; Bahr, J.) || IFAM, Hansastr. 27d, 80686 Munich, Germany (Zollmer, V.; Werner, C.) || IZM, Hansastr. 27d, 80686 Munich, Germany (Ndip, I.; Curran, B.) || IIS, Hansastr. 27d, 80686 Munich, Germany (Oehler, F.; Milosiu, H.) |
| Abstract | Maskless direct printing is a good candidate for rapid prototyping and even emerging for manufacturing of large scale electronics. Aiming for rapid prototyping of small multi-layer modules the study combines Aerosol $Jet^{®}$ printing and ink jet printing. Conductive silver traces down to 20µm width were printed together with large interconnect areas on isolating layers of inorganic-organic hybrid polymer $(ORMOCER^{®})$ and on glass substrates. New copper nickel inks and high-k $ORMOCER^{®}s$ filled with barium titanate particles are paving a path to integrated printed resistors and capacitors. Although some issues still need to be resolved for a commercial grade process the detail solutions presented for the first time and the active integrated circuits and devices attached to the same substrate demonstrate a path and the principle technical feasibility of this method for heterogeneous integration. |
| Starting Page | 1 |
| Ending Page | 6 |
| File Size | 2093873 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424485536 |
| e-ISBN | 9781424485550 |
| e-ISBN | 9781424485543 |
| DOI | 10.1109/ESTC.2010.5642953 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-09-13 |
| Publisher Place | Germany |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | RNA Copper |
| Content Type | Text |
| Resource Type | Article |
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