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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Shin-Yueh Yang Tsung-Lin Chou Chien-Fu Huang Chung-Jung Wu Chia-Liang Hsu Kuo-Ning Chiang |
| Copyright Year | 2010 |
| Description | Author affiliation: Epistar Corporation, 5 Li-hsin 5th Rd., Science-based Industrial Park, Hsinchu, Taiwan 300, R. O. C. (Chien-Fu Huang; Chia-Liang Hsu) || Advanced Microsystem Packaging and Nano-Mechanics Research Lad PME, Advanced Packaging Research Center, Dep. Of Power Mechanical Engineering, National Tsing Hua University, HsinChu, Taiwan 300, R. O. C. (Shin-Yueh Yang; Tsung-Lin Chou; Chung-Jung Wu; Kuo-Ning Chiang) |
| Abstract | High-power light emitting diodes (LEDs) are found in a number of applications in high-volume consumer markets, such as illumination, signalling, screen backlights, automotives, and others, because of the numerous advantages of LEDs, including low power cost, long life span, and high efficiency. During the manufacturing process, the high-power LED chips are subjected to mechanical and thermal loadings. Wire bonding is one of the major processes in the LED packaging process that provide electrical interconnection between the bonding pad and the lead. However, due to bad parameter setup in a wire bonder, the LED will crack and the pad will peel after wire bonding. In this study, the strength of LED is determined for the design requirement in order to ensure good reliability of wire bonding. Pointload test (PLT) and focused ion beam (FIB) are used to determine the maximum allowable force the epilayer can withstand, which is approximately 75 g. By combining the finite element method and experimental data, a useful design tool to confirm LED die strength is provided. Finite element results of contact analysis show that the stress concentration area is located on the edge of the pin and maximum stress (227 MPa) occurs in the epilayer. Parametric study is employed to find ways to reduce stress in LED layer. The results indicate that increasing pad thickness is the major factor that can reduce stress and enhance LED die strength. PLT and FIB experiments are also performed to confirm simulation results. |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 1857803 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424485536 |
| e-ISBN | 9781424485550 |
| e-ISBN | 9781424485543 |
| DOI | 10.1109/ESTC.2010.5642840 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-09-13 |
| Publisher Place | Germany |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Materials reliability Packaging Light emitting diodes Silicon Facsimile Mirrors Bonding |
| Content Type | Text |
| Resource Type | Article |
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