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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Tiwei Wei Xing Qiu Lo, J.C.C. Lee, S.W.R. |
| Copyright Year | 2015 |
| Description | Author affiliation: Center for Adv. Microsyst. Packaging, Hong Kong Univ. of Sci. & Technol., Kowloon, China (Tiwei Wei; Xing Qiu; Lee, S.W.R.) || Dept. of Mech. & Aerosp. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China (Lo, J.C.C.) |
| Abstract | This paper proposed and developed an effective thermal management method for HVLED packaging with wafer level bumping technology. In the HVLED package, multiple thermal bumps were fabricated on HVLED chips to enhance heat dissipation. Cu-Sn-Cu bumps were used. The size, pitch and stand-off height of bumps were optimized for underfill dispensing. Moreover, a high thermal conductivity underfilll was used to further improve the thermal performance of the package. |
| Starting Page | 54 |
| Ending Page | 57 |
| File Size | 1395134 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781467396905 |
| e-ISBN | 9781467383561 |
| DOI | 10.1109/IMPACT.2015.7365183 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-10-21 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Layout Packaging Light emitting diodes Thermal conductivity Flip-chip devices Bonding Assembly |
| Content Type | Text |
| Resource Type | Article |
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