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Content Provider | IEEE Xplore Digital Library |
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Author | Friedrich, J. Mix, R. |
Copyright Year | 2006 |
Description | Author affiliation: Fed. Inst. of Mater. Res. & Testing, Berlin (Friedrich, J.; Mix, R.) |
Abstract | Several adhesion problems between metal layers and polymers exist in various electronic assemblies due to the deficiency or absence of strong covalent bonds associated with the strongly different thermal expansion coefficients of the materials. Here, ways are described to establish well-defined covalent bonds at the interfaces. Additionally, unwished redox-reactions between metals, metal oxides and polymers can disturb covalent bonds and therefore the adhesive bond strength |
Sponsorship | IEEE CPMT |
Starting Page | 818 |
Ending Page | 826 |
File Size | 10128787 |
Page Count | 9 |
File Format | |
ISBN | 1424405521 |
DOI | 10.1109/ESTC.2006.280106 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2006-09-05 |
Publisher Place | Germany |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Plasma materials processing Plasma applications Thermal expansion Adhesives Semiconductor materials Inorganic materials Electronic packaging thermal management Polymers Bonding Plasma chemistry |
Content Type | Text |
Resource Type | Article |
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