NDLI: Failure Modes and Fatigue Testing Characteristics of SMT Solder Joints

Content Provider	IEEE Xplore Digital Library
Author	Zdzislaw, D. Marcin, S.
Copyright Year	2006
Description	Author affiliation: Inst. of Precision & Biomed. Eng., Warsaw Univ. of Technol., Warszawa (Zdzislaw, D.; Marcin, S.)
Abstract	The work is connected with implementation of lead-free technology by small producers of electronic equipment, according to RONS Directive of European Community. Results of accelerated mechanical and thermal cycling fatigue tests of PbSn and lead-free solder joints, realized in GreenRoSE EC Project, for accelerated reliability assessment, are described. The aim of the work is development of cheap test methods, applicable by small producers of electronic equipment. Thermal shock cycling method and mechanical method of cycling bending of PCB samples with soldered SMT components are discussed. Charge factors applied by mechanical and thermal tests are compared. FEM models are applied. Thermal shock cycling is realized in two-zone climatic chamber. Developed in TU Warsaw PC controlled mechanical test stand is presented. For obtaining of relative deformation between soldered component and PCB, was applied the bending system exerting moment, flexion radius and other charge conditions, uniform for all components soldered on whole surface of the PCB sample. The failures are detected by measuring the joints resistance. Design and data of special test samples for simple resistance measurements and failures detection are shown. Relation between bending curvature of PCB sample and joint resistance, before and after the test, is shown. The failure modes are classified. Influence of test parameters on failure distribution data and characteristic of joint parameters are discussed. The failure distribution on Weibull plots for mechanical and thermal cycling are compared. The investigations showed the possibility of simplified reliability assessment of lead-free electronic products by mechanical fatigue testing. Advantage of this method is lower cost and shorter test time in comparing with thermal cycling
Sponsorship	IEEE CPMT
Starting Page	1187
Ending Page	1193
File Size	6832097
Page Count	7
File Format	PDF
ISBN	1424405521
DOI	10.1109/ESTC.2006.280160
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-09-05
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronic equipment Surface-mount technology Environmentally friendly manufacturing techniques Electric shock Electronic equipment testing Life estimation Lead Fatigue Electrical resistance measurement Soldering
Content Type	Text
Resource Type	Article

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