NDLI: Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils

Content Provider	IEEE Xplore Digital Library
Author	Cauwe, M. Vandecasteele, B. Gielen, A. De Baets, J. van den Brand, J. Kusters, R.
Copyright Year	2011
Description	Author affiliation: imec - Cmst, Technologiepark 914a, B-9052 Zwijnaarde, Belgium (Cauwe, M.; Vandecasteele, B.; Gielen, A.; De Baets, J.) \|\| Holst Centre, HTC31, Postbus 8550, 5605 KN Eindhoven, the Netherlands (van den Brand, J.; Kusters, R.)
Abstract	The aim of the research described in this paper is to develop a low-cost, roll-to-roll compatible process for the realization of electronic systems in foil using chip embedding. The small cost makes these systems suitable for disposable applications as food labels, medicine packages or smart bandages. Surface mount attaching of components on foils is a well-known process for building systems-in-foil. When using low-cost films like PEN and PET, there are serious restrictions on the maximum temperatures that can be used for the surface mounting process (soldering, adhesive bonding). Surface mounting has the additional disadvantage that the components are on the surface of the foil and are therefore not well protected mechanically and physically. The proposed process flow for embedding thin chips in PET foils overcomes these limitations. A key aspect of this technology is the application of a suitable adhesive to encapsulate the chips. The resulting product is based on full-metal copper which has a good thermal and electrical conductivity and allows for fine pitches. The process is compatible with several metal foils (Cu, Al …), offering further possibilities in cost reduction, and does not rely on bumping of the chips or plating of the interconnections to the chips.
Starting Page	1
Ending Page	6
File Size	688065
Page Count	6
File Format	PDF
ISBN	9781467306942
e-ISBN	9780956808608
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-09-12
Publisher Place	United Kingdom
Access Restriction	Subscribed
Rights Holder	IMAPS
Subject Keyword	Heating chip embedding low-cost Reliability Positron emission tomography PET roll-to-roll
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in