NDLI: Low temperature die-bonding with Ag flakes

Content Provider	IEEE Xplore Digital Library
Author	Sakamoto, S. Suganuma, K.
Copyright Year	2011
Description	Author affiliation: ISIR, Osaka University, 8-1 Mihogaoka, Ibaraki, 567-0047, Japan (Sakamoto, S.; Suganuma, K.)
Abstract	Operating temperature of power semiconductors is expected to rise beyond 150 °C especially such for GaN or SiC. Die-bonding must maintain good reliability in such high temperatures. Currently, the conventional Ag-epoxy conductive adhesives and Pb-free solders have been used for current Si die attachment. They are, however, difficult to satisfy the requirements for such ultra-heat resistant uses. In order to develop of ultra-heat resistant die-attach technology at low temperature, new die-bonding material was proposed, i.e., nano-meter thin Ag flakes. The Ag flakes have large surface area and thickness less than 100 nm. They are mixed with alcohol as a solvent to be formulated into a paste. The other Ag pastes were also made by using Ag micron particles and Ag particles with submicron. These Ag pastes were stencil-printed on a Cu substrate with or without electrolytic plated Au or Ag. Finally, die-bonding was carried out. These samples were bonded in a temperature range from 160 °C to 200 °C for 60 minutes. As the result, the die-bonding with the new Ag nano-meter thin flakes exhibits an about twice times higher bonding strength than the conventional Ag paste die-bonding. By observing cross-sections of the samples after sintering revealed that the nano-meter thin Ag flake die-bonding has denser microstructure than the conventional die-bonding. Shear strength of die-bonding was improved by using the nano-meter thin Ag flakes. It was revealed that the nano-meter thin Ag flakes can form a reliable interconnect below 200 °C.
Starting Page	1
Ending Page	5
File Size	1030695
Page Count	5
File Format	PDF
ISBN	9781467306942
e-ISBN	9780956808608
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-09-12
Publisher Place	United Kingdom
Access Restriction	Subscribed
Rights Holder	IMAPS
Subject Keyword	low-temperature sintering die-bonding Ag flake Materials reliability Packaging Ag paste Facsimile Polymers Substrates
Content Type	Text
Resource Type	Article

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