NDLI: Error tolerant DNA self-assembly by link-fracturing

Content Provider	IEEE Xplore Digital Library
Author	Young Bok Kim Yong-Bin Kim Lombardi, F.
Copyright Year	2009
Description	Author affiliation: Dept of Electrical and Computer Engineering, Northeastern University, Boston, USA (Young Bok Kim; Yong-Bin Kim; Lombardi, F.)
Abstract	This paper proposes and evaluates link fracturing as an approach for error tolerance in self-assembly by utilizing a DNA chain as a link between two blocks of molecules. Through the use of restriction enzymes, link fracturing breaks the connecting DNA chain between two blocks if an incorrect assembly has occurred due to the erroneous growth of tiles. Two error tolerant techniques are proposed by fracturing of the DNA chain links, namely 1-link and 2-link. Using the tool Xgrow, simulations under the Kinetic Tile Assembly Model (KTAM) are performed. Results show that 2-link fracturing achieves an improvement in error rate as compared to a normal assembly; moreover this is accomplished with little overhead in assembly size and execution complexity. The 1-link method shows 100% error free growth with moderate overhead as compared to normal growth and other existing error tolerant methods.
Starting Page	75
Ending Page	78
File Size	3507568
Page Count	4
File Format	PDF
ISBN	9781424450343
DOI	10.1109/SOCDC.2009.5423879
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-11-22
Publisher Place	Korea (South)
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	self-assembly Self-assembly DNA defects error tolerance manufacturing
Content Type	Text
Resource Type	Article

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