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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Cong, J. Guojie Luo |
| Copyright Year | 2009 |
| Description | Author affiliation: Computer Science Department University of California, Los Angels, USA (Cong, J.; Guojie Luo) |
| Abstract | 3D IC technologies have recently attracted great attention due to the potential performance improvement, power consumption reduction and heterogeneous integration. In this paper we present a 3D physical design flow based on OpenAccess (named 3D-Craft) to facilitate the rapid adoption of 3D technology. The OpenAccess extension for 3D-Craft is discussed, and the key components including the 3D placer mPL-3D and the 3D router TMARS are presented. We also demonstrate the application of 3D-Craft for the 3D physical design of an open-source processor, and show that the 3D implementation can reduce both the half-perimeter wirelength and the routed wirelength by about 30% compared to the 2D implementation. |
| Starting Page | 1103 |
| Ending Page | 1107 |
| File Size | 5906663 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424448869 |
| DOI | 10.1109/ICCCAS.2009.5250324 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-07-23 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Radio frequency Computer science Energy consumption Design automation Temperature Thermal conductivity Routing Silicon Copper Three-dimensional integrated circuits |
| Content Type | Text |
| Resource Type | Article |
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