NDLI: 100W GaN PA in low cost 3×6mm plastic DFN package providing the smallest “true SMT” footprint for pulse RADAR applications

Content Provider	IEEE Xplore Digital Library
Author	YuanFei Cen McCann, D.
Copyright Year	2012
Description	Author affiliation: M/A-COM Technology Solutions, 1500 Hughes Way, Suite C-100, Long Beach, CA 90810, U.S.A. (YuanFei Cen; McCann, D.)
Abstract	In this paper we report on the first reported use of high power GaN PA's in low cost plastic 3×6mm DFN packages for true SMT insertion in pulse RADAR applications. The individual plastic packaged GaN PA's are intended for broadband use in pulsed mode of operation and powers levels of 100W through S-Band, representing the smallest size true SMT GaN packages at this power level ever reported. The paper will describe in detail the obstacles to be overcome before GaN devices can be used in traditional high volume COTS manufacturing environments and the advantages over traditional packaging approaches currently available in the marketplace. Transient and average thermal measurements under power will be provided. The authors believe this to be a first for GaN devices packaged to this power level that makes use of existing plastic packaging techniques available in subcontract manufacturing facilities without compromising performance or reliability while reducing cost and size of the final application solution.
Starting Page	333
Ending Page	336
File Size	729200
Page Count	4
File Format	PDF
ISBN	9781467323024
e-ISBN	9782874870286
e-ISBN	9782874870262
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-10-29
Publisher Place	Netherlands
Access Restriction	Subscribed
Rights Holder	European Microwave Assoc
Subject Keyword	Performance evaluation Power Amplifiers TDMA RADAR SATCOM Plastic SiC Gallium nitride DFN Temperature measurement COTS Fingers GaN Logic gates Plastics Transient analysis
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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