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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yu-Chen Chang Tz-Cheng Chiu Yu-Ting Yang Yi-Hsiu Tseng Xi-Hong Chen Pu-Shan Huang |
| Copyright Year | 2015 |
| Description | Author affiliation: ASE Group Chung-Li, Chungli, Taiwan (Yu-Ting Yang; Yi-Hsiu Tseng; Xi-Hong Chen; Pu-Shan Huang) || Nat. Cheng Kung Univ., Tainan, Taiwan (Yu-Chen Chang; Tz-Cheng Chiu) |
| Abstract | Fatigue characteristics of polyimide thin film strips prepared with realistic wafer-level redistribution processes were investigated experimentally. Uniaxial tensile tests were first conducted on the thin film specimens to characterize the stress-strain relationship, and to measure ultimate strength and elongation. Both strain- and stress-controlled fatigue cycling experiments were then performed. Under strain-controlled cyclic fatigue loading an obvious stress relaxation behavior was observed. The stress relaxation characteristic depends only on the applied strain range, but not on the level of the average strain. Under stress-controlled cyclic fatigue loading the polyimide thin film exhibited both viscoelastic and plastic responses, and the peak plastic strain followed a power-law increasing trend as the fatigue cycle increased. A fatigue strain evolution model was developed by statistically fitting the stress-controlled fatigue responses with a physics-based mathematical model. The fatigue response model can be applied for developing design rules for extending the polyimide based redistribution interconnect technology to the regimes of larger chip size and higher input/output densities. |
| Starting Page | 233 |
| Ending Page | 236 |
| File Size | 951397 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781467396905 |
| e-ISBN | 9781467383561 |
| DOI | 10.1109/IMPACT.2015.7365229 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-10-21 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Films Loading Polyimides Fatigue Plastics Stress Strain |
| Content Type | Text |
| Resource Type | Article |
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