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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | De-Shin Liu Chieh-Jung Lu Cho-Liang Chung |
| Copyright Year | 2015 |
| Description | Author affiliation: Dept. of Mech. Eng., Nat. Chung Cheng Univ., Chiayi, Taiwan (De-Shin Liu; Chieh-Jung Lu) || Dept. of Mater. Sci. & Eng., I-Shou Univ., Kaohsiung, Taiwan (Cho-Liang Chung) |
| Abstract | This paper employs a method of measuring the relation between eject pin and UV tape which could cause chip damage during the die bond process. According to the enhancement of LCD technique, lighter, thinner, shorter and smaller has become a sign for the device. Compared with the traditional package, driver IC needs to be designed as a slender shape because of the finite placing space. During die pick process, it can be easily caused damage by the over loaded bending force because of its shape during die bond process. This paper based on passes research experience focus on developing new test for interface strength between UV tape and chip, also the method of filming die bond process with high speed camera. This paper also provided the simple numerical models for UV tape, eject pin and to simulate the interaction of eject pin and UV tape during die bond process. |
| Starting Page | 288 |
| Ending Page | 291 |
| File Size | 986685 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781467396905 |
| e-ISBN | 9781467383561 |
| DOI | 10.1109/IMPACT.2015.7365203 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-10-21 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Finite element method Computational modeling High speed camera Cohesive behavior Die pick process Cameras Silicon Finite element analysis Yttrium Stress Load modeling |
| Content Type | Text |
| Resource Type | Article |
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