Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Ming-Che Hsieh |
| Copyright Year | 2015 |
| Description | Author affiliation: Product & Technol. Marketing, STATS ChipPAC Co., Ltd., Hsinchu, Taiwan (Ming-Che Hsieh) |
| Abstract | The wafer level chip scale package (WLCSP) has been widely used in mobile chipset applications since it provides a strong solution to satisfy the demands for smaller form factor, multifunctional and low cost devices. As WLCSP moves towards lower cost, higher performance and finer pitch designs to meet the increasing requirements of electronic products, there are a number of challenges in preventing package failure and enhancing reliability that need to be overcome. In general, the failure mode in WLCSP usually occurs near the solder joints and the package reliability becomes worse if the WLCSP design has a larger die size or smaller ball pitch. To evaluate the solder joint fatigue life, the Coffin-Manson equation is typically utilized. For the purpose of analyzing the solder joint fatigue life, the 2P2M WLCSPs which mean that there are two polymer layers and two metal layers (one under-bump-metallurgy (UBM) layer and one redistribution layer (RDL) on the passivated wafer) were examined in board level reliability (BLR) thermal cycling test (TCT; follows JEDEC standards for the temperature change from -40°C to 125°C). The three-dimensional (3D) finite element analysis (FEA) with rate dependent material nonlinearity behaviors was constructed to study the corresponding creep behaviors of Sn4.0Ag0.5Cu (SAC405) solder joints in four 2P2M WLCSP with different package size and ball pitch. By correlating the BLR TCT and simulation results, the fatigue ductility coefficient and the reciprocal of the fatigue ductility exponent in the modified Coffin-Manson equation for solder joint fatigue life in above WLCSP devices can be developed with the correlation of experimental and simulation results. With these equations, the solder joint fatigue life in these WLCSPs can be easily estimated through simulations without any evaluation of BLR TCT experiments. It is believed that the results not only provide an effective method to predict the package reliability life but also can save time and cost in the development stage. |
| Starting Page | 65 |
| Ending Page | 68 |
| File Size | 1026987 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781467396905 |
| e-ISBN | 9781467383561 |
| DOI | 10.1109/IMPACT.2015.7365195 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-10-21 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Creep Fatigue Finite element analysis Mathematical model Reliability Soldering Strain |
| Content Type | Text |
| Resource Type | Article |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|