Please wait, while we are loading the content...
Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hu, I. MengKai Shih Kao, G. |
| Copyright Year | 2015 |
| Description | Author affiliation: Stress-Thermal Lab., Adv. Semicond. Eng. Inc., Kaohsiung, Taiwan (Hu, I.; MengKai Shih; Kao, G.) |
| Abstract | HFCBGA is a thermally enhanced FCBGA through mounting a metal heat spreader to the rear side of the chip via thermal interface materials (TIM), where a high thermal conductive silver filler silicone-based TIM is selected. Thermal resistance of junction to case (θJC) is the critical thermal performance index, it's checked not only at the beginning of the product life, but also after several types of reliability tests, include TCT, HTS and HAST. TIM void, BLT and θJC is checked in this experiment. The result shows there has 0~1.3% area ratio TIM void at the center after TCT 500 cycles and keeps at the same level after TCT 1000 cycles; HTS 1000 hours and HAST 96 hours doesn't induce TIM void. However, thermal performance result shows the effect of this tiny void is indistinct. On the other hand, the result shows TIM thickness is correlated to thermal performance. Meanwhile, that the TIM thickness after TCT 1000 is thinner than it before TCT explains why the thermal performance is not only without degradation but even improved after reliability test. |
| Starting Page | 188 |
| Ending Page | 191 |
| File Size | 889503 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781467396905 |
| e-ISBN | 9781467383561 |
| DOI | 10.1109/IMPACT.2015.7365218 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-10-21 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Temperature measurement Thermal resistance Heating Electronic packaging thermal management Thermal conductivity Reliability Junctions |
| Content Type | Text |
| Resource Type | Article |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|