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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Zhu, S.-W. Shih, C.-P. Chiu, T.-C. Shen, G.S. |
| Copyright Year | 2010 |
| Description | Author affiliation: Department of Mechanical Engineering, National Cheng Kung University, 1 Ta-Hsueh Rd., Tainan, Taiwan 701 (Zhu, S.-W.; Shih, C.-P.; Chiu, T.-C.) || Research and Strategy Development Center, ChipMOS Technologies, Inc., 5 Nanke 7 Rd., Southern Taiwan Science Park, Tainan County, Taiwan 741 (Shen, G.S.) |
| Abstract | The fracture responses of interfaces under either monotonic or fatigue loading conditions were investigated by using double cantilever beam (DCB) tests. The tests were performed using a custom-developed micro-tester. The applied load vs. interfacial crack opening relationship obtained from the DCB experiment was analyzed by using a beam on elastic foundation-based closed-form expression for determining the critical strain energy release rate or the fatigue delamination growth rate for the interface of interest. From the analysis the relationship between the crack growth rate and the applied strain energy release rate range was determined. For the polyimide-SiN interface, the subcritical fatigue delamination growth rate was found to display a power-law dependence on the applied strain energy release rate range with an exponent of 3.2. |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 178129 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424497836 |
| ISSN | 21505942 |
| e-ISBN | 9781424497867 |
| e-ISBN | 9781424497850 |
| DOI | 10.1109/IMPACT.2010.5699574 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-10-20 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Adhesives Loading Fatigue Silicon Delamination Strain |
| Content Type | Text |
| Resource Type | Article |
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