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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Tien-Tsorng Shih Bing-Hua Chen Win-Der Lee Mu-Chun Wang |
| Copyright Year | 2011 |
| Description | Author affiliation: Dept. of Electronics Engineering, National Kaohsiung University of Applied Science, Kaohsiung, Taiwan, No.1, Hsinhsing Rd., Hsinfong, Hsinchu, Taiwan 30401 (Tien-Tsorng Shih; Bing-Hua Chen) || Department of Electrical Engineering, Lee-Ming Institute of Technology, Taipei, Taiwan, No.1, Hsinhsing Rd., Hsinfong, Hsinchu, Taiwan 30401 (Win-Der Lee) || Dept. of Electronic Engineering, Minghsin University of Science and Technology, Hsinchu, Taiwan, No.1, Hsinhsing Rd., Hsinfong, Hsinchu, Taiwan 30401 (Mu-Chun Wang) |
| Abstract | To seek and implement the high-speed circuit products, the high-pin count package is necessary to be considered well. Adopting polymer core solder ball in ball-grid-array (BGA) package instead of solid solder ball in cost and reliability consideration is a practical selection. After the reflow process, the outward appearance for polymer solder ball shows the better quality, especially in oxidation effect. The uniformity of stand-off height performance for polymer solder ball without flux assistance is better than that for solid solder ball. After shearing test, the adhesion capability for polymer core solder ball on carrier substrate still represents the good performance, compared with solid solder ball. |
| Starting Page | 431 |
| Ending Page | 434 |
| File Size | 1114019 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781457713873 |
| ISSN | 21505934 |
| e-ISBN | 9781457713897 |
| e-ISBN | 9781457713880 |
| DOI | 10.1109/IMPACT.2011.6117248 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-10-19 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Adhesives Lead Solids Polymers Substrates |
| Content Type | Text |
| Resource Type | Article |
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