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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Peishan Hsieh Kwang-Lung Lin |
| Copyright Year | 2011 |
| Description | Author affiliation: Department of Materials Science and Engineering, National Cheng Kung University, 1 University Road, Tainan, Taiwan 70101, R.O.C. (Peishan Hsieh; Kwang-Lung Lin) |
| Abstract | Electroless NiP deposit has been frequently mentioned as the barrier laer for Cu substrate or metallization for the soldering process. The NiP deposit is solderable with many solders at appropriate temperature and operation condition. The present study attempted to investigate the wetting behavior of the Sn3Ag solder on the electroless NiP with wetting balance at 250°C and 270°C. The cross section of the wetting specimen was further investigated for the interaction and the interfacial microstructure between the solder and the NiP/Cu substrate. The interface was composed of Ni3Sn4 and Ni3P compound layers. A Ni-Sn-P layer was detected between these two compound layers. The thickness of these layers was analyzed for the growth kinetics. The growth of these layers were found to follow an empirical power law log h(thickness) = log k(constant) + n log t(time). The variation in n values was discussed in relating to the growth mechanism of these two layers. |
| Starting Page | 29 |
| Ending Page | 32 |
| File Size | 749210 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781457713873 |
| ISSN | 21505934 |
| e-ISBN | 9781457713897 |
| e-ISBN | 9781457713880 |
| DOI | 10.1109/IMPACT.2011.6117224 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-10-19 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Metallization Tin Nickel Copper Compounds Soldering Substrates |
| Content Type | Text |
| Resource Type | Article |
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