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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | De-Shin Liu Shu-Shen Yeh Chieh-Jung Lu Chan-Wei Chang Chen-Wei Hung An-Hong Liu Hung-Hsin Liu |
| Copyright Year | 2011 |
| Description | Author affiliation: Advanced Institute of Manufacturing for High-tech Innovations and Department of Mechanical Engineering, National Chung Cheng, University, Chia-Yi, Taiwan, R.O.C. (De-Shin Liu; Shu-Shen Yeh; Chieh-Jung Lu; Chan-Wei Chang; Chen-Wei Hung) || ChipMOS TECHNOLOGIES INC. Science-Bases Industrial Park, Tainan, Taiwan, R.O.C. (An-Hong Liu; Hung-Hsin Liu) |
| Abstract | The thermal issues of Chip-On-Film (COF) packages are becoming increasingly important for high-pin count chips, whose performance is becoming increasingly limited by the maximum power that can be spread without exceeding the maximum junction temperature. This study conducts a numerical investigation to investigate the relationship between power dissipation and the surface temperature of the thermal chip in COF applications. This study develops an ANSYS finite element (FE) model to simulate the junction temperature and temperature distribution within the COF package under various boundary conditions. Based on an effective methodology of equivalent models for thermal conductance, comparing the simulation results with the reference reviewing confirms the validity of the numerical model. Several parametric studies reveal the effects of various configurations of the thermal model. This study also analyzes the thermal resistance at the junction of the package. Results show that the natural convection of the COF package with thermally conductive tape (TCT) achieves a cooling function that keeps the junction temperature of the COF package under 85°C without using a fan. The FE models in this study have enormous potential to quickly assess the thermal limits of many future COF packages and their variations. |
| Starting Page | 273 |
| Ending Page | 275 |
| File Size | 601669 |
| Page Count | 3 |
| File Format | |
| ISBN | 9781457713873 |
| ISSN | 21505934 |
| e-ISBN | 9781457713897 |
| e-ISBN | 9781457713880 |
| DOI | 10.1109/IMPACT.2011.6117260 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-10-19 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal resistance Heating Chip-on-film (COF) Electronic packaging thermal management Thermal conductivity Thermal performance design Numerical models Finite element methods Copper Finite element analysis (FEA) |
| Content Type | Text |
| Resource Type | Article |
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