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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Ming-Yao Yen Yuk-Nam Hung Kwok-Wai Yee Hsien-Chang Chen Hsin-Sen Liang Lefebvre, M. |
| Copyright Year | 2010 |
| Description | Author affiliation: Dow Electronic Materials, The Dow Chemical Company, 15 On Lok Mun Street, On Lok Tsuen, Fanling, Hong Kong (Ming-Yao Yen; Yuk-Nam Hung; Kwok-Wai Yee) || Dow Electronic Materials, The Dow Chemical Company, 455 Forest Street, Marlborough, MA 01752 (Lefebvre, M.) || Dow Electronic Materials, The Dow Chemical Company, No. 6, Lane 280, Chung Shan North Road, Ta Yuan Industrial Zone, Ta Yung Hsiang, Taoyuan Hsien, Taiwan, R.O.C. (Hsien-Chang Chen; Hsin-Sen Liang) |
| Abstract | As the electronic products become multi-functional and complicated, relatively high-density pattern must be designed to meet these requirements. As a result, multilayer printed circuit boards (PCBs) with high aspect ratio (AR>13) through hole metallization become the main trend in fabrication. That is, how to metalize the PCBs by Copper deposit with high throwing power and reliability becomes a major research. In this topic, a batch system of electroplating equipment designed for the use in the pilot line for acid Copper plating are discussed. It is included a comparison of distance between anodes, anode and cathode, different types of solution agitation, such as air, paddle, and cathode vibration. According to the study results, the throwing power for plate-through hole and microvia plating and deposition distribution could be improved by the adjustment of anode distance (anode/anode or anode/cathode), solution agitation (both air and paddle), and rock vibration, of cathode during plating. |
| Starting Page | 1 |
| Ending Page | 3 |
| File Size | 218383 |
| Page Count | 3 |
| File Format | |
| ISBN | 9781424497836 |
| ISSN | 21505942 |
| e-ISBN | 9781424497867 |
| e-ISBN | 9781424497850 |
| DOI | 10.1109/IMPACT.2010.5699473 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-10-20 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Vibrations Materials Cities and towns Copper System-on-a-chip Anodes Cathodes |
| Content Type | Text |
| Resource Type | Article |
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