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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Tang, M.C.Y. Li, C.P.L. Yee, D.K.W. |
| Copyright Year | 2010 |
| Description | Author affiliation: Dow Electronic Materials, The Dow Chemical Company, Hong Kong, China (Tang, M.C.Y.; Li, C.P.L.; Yee, D.K.W.) |
| Abstract | The implementation of the RoHS Directive in 2006 has led to a requirement that solders used in the fabrication of PCBs should be lead-free. Higher melting point lead-free solder alloys require increases in reflow temperatures, compared to eutectic tin-lead alloy solders. This has led to a substantial increase in the number of lead-free capable laminate materials over the last few years. Multi-functional epoxy resins using phenolic curing systems and halogen-free materials now represent the main stream materials used for PCB fabrication, Such materials provide higher thermal stability and lower coefficients of thermal expansion, but also have higher chemical resistance than normal performance materials. In order to properly desmear materials with increased chemical resistance, optimized solvent swell systems are required. This article presents experimental data to illustrate the limitations of typical solvent swell system performance on those newly developed materials in terms of desmear rate, surface topography, and reliability performance. The performance of a new solvent swell process capable of overcoming the drawbacks of current solvent swell systems will be described. This new process is compatible with the full range of high performance laminate materials available in the market. |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 413186 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424497836 |
| ISSN | 21505942 |
| e-ISBN | 9781424497867 |
| e-ISBN | 9781424497850 |
| DOI | 10.1109/IMPACT.2010.5699472 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-10-20 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Solvents Surface topography Resins Reliability Surface treatment |
| Content Type | Text |
| Resource Type | Article |
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