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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Monier-Vinard, E. Bissuel, V. Dia, C. Daniel, O. |
| Copyright Year | 2012 |
| Description | Author affiliation: THALES GLOBAL SERVICES, 18, avenue du marechal Juin - 92366 Meudon la foret Cedex - France (Monier-Vinard, E.; Bissuel, V.; Dia, C.; Daniel, O.) |
| Abstract | Nowadays a high-level integration with unprecedented functionality and efficient performances is achieved through 3D packaging techniques known as System-In-Package (SIP). The paper describes the reduction process conducted on a realistic SIP module case in order to establish a behavioral thermal network having a large number of power sources. Besides this device has been slightly modified to focus on the recent 3D integration techniques such as the stacking of chip, multi-chips side by side architecture or the embedding of conventional individually-packaged Integrated Circuits (IC). These works compared the prediction of a DELPHI style Compact Thermal Model (CTM)[1][6] to a numerical Detailed Thermal Model with for aim to illustrate the diminution of computation delays, the expected accuracy and some efficient ways to improve it. Then it describes the performance of a novel methodology that nests a set of Sub-Compact Thermal Models (SCTM) within the detailed numerical model, far less grid-intensive, and its ability to preserve the final SIP CTM quality. |
| Starting Page | 1170 |
| Ending Page | 1178 |
| File Size | 866175 |
| Page Count | 9 |
| File Format | |
| ISBN | 9781424495337 |
| ISSN | 10879870 |
| e-ISBN | 9781424495320 |
| e-ISBN | 9781424495313 |
| DOI | 10.1109/ITHERM.2012.6231555 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-30 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Computational modeling Numerical models Heating Bismuth Genetic algorithms Junctions Predictive models algorithm SIP Compact thermal model genetic |
| Content Type | Text |
| Resource Type | Article |
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