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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Choi, C. Dasgupta, A. |
| Copyright Year | 2012 |
| Description | Author affiliation: ABC Scientific Paper Publishing, CALCE Electronic Products and Systems Consortium, Mechanical Engineering Department, University of Maryland, College Park, 11942 USA (Choi, C.; Dasgupta, A.) |
| Abstract | This study focuses on assessing the effects of temperature on vibration durability of SAC305 PWAs under random vibration excitation on a repetitive shock (RS) shaker. Major complexities involved in quantifying random vibration response and durability data are first discussed through a comparison of specimen unimodal response under harmonic excitation versus multimodal response to random excitation. Three dimensional FEA global modal analysis is conducted to quantify the modal frequencies and mode shapes and is calibrated with the modal frequencies determined from the vibration test. This modal analysis at room temperature provides an important baseline for quantifying the subsequent changes as a function of the test temperature. The response of a PWA with a SAC305 Chip scale Thin Core Ball Grid Array (CTBGA) component is characterized under RS random excitation at different temperatures (125°C, 25°C and −50°C), to qualitatively demonstrate the role of temperature on vibration response. Preliminary test data for vibration durability are also conducted at these temperatures and the results of these accelerated vibration durability tests are included to provide preliminary indication of the role of temperature on vibration durability. Quantification of vibration damage accumulation rates under RS random excitation at different temperatures will be presented in future through more comprehensive random vibration durability experiments, detailed FEA dynamic response analyses and fatigue damage analysis in the time domain using cycle counting methods. |
| Starting Page | 745 |
| Ending Page | 752 |
| File Size | 812345 |
| Page Count | 8 |
| File Format | |
| ISBN | 9781424495337 |
| ISSN | 10879870 |
| e-ISBN | 9781424495320 |
| e-ISBN | 9781424495313 |
| DOI | 10.1109/ITHERM.2012.6231502 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-30 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Vibrations Strain Stress Fatigue Acceleration History Harmonic analysis temperature Repetitive Shock (RS) combined loading ChipArray Thin Core Ball Grid Array (CTBGA) random vibration |
| Content Type | Text |
| Resource Type | Article |
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