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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Arfaei, B. Wentlent, L. Joshi, S. Alazzam, A. Tashtoush, T. Halaweh, M. Chivukula, S. Yin, L. Meilunas, M. Cotts, E. Borgesen, P. |
| Copyright Year | 2012 |
| Description | Author affiliation: Universal Instruments Corporations, Conklin, NY 13748, USA (Yin, L.; Meilunas, M.) || Department of Systems Science & Industrial Engineering, Binghamton University, New York 13902, USA (Arfaei, B.; Wentlent, L.; Joshi, S.; Alazzam, A.; Tashtoush, T.; Halaweh, M.; Chivukula, S.; Borgesen, P.) || Physics Department and Materials Science Program, Binghamton University, New York, USA (Cotts, E.) |
| Abstract | Effects of solder alloy, volume and pad finishes on various aspects of microstructure and the corresponding thermomechanical properties of SnAgCu solder joints were investigated. Particular attention was focused on the behavior of solder joints with interlaced Sn grain morphologies. Crossed polarizer microscopy and scanning electron microscopy (SEM) were used to characterize Sn grain structures. Precipitate sizes and distributions were measured using backscattered scanning electron microscopy and quantified using image analysis software. Mechanical properties including hardness and indentation creep were measured. Results show that the amount and frequency of interlacing increased as the joint size decreased, as the amount of Ag in the solder increased, and if the joint was reflowed on ENIG substrates. The interlaced structure was harder and more creep resistant compared to the common beach ball morphology. Image analysis results showed this to be related to much higher densities of secondary precipitates in the interlaced regions. A mechanistic understanding of the microstructure is discussed and recommendations are made as to the design of more reliable solder joints. |
| Starting Page | 392 |
| Ending Page | 398 |
| File Size | 1389913 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781424495337 |
| ISSN | 10879870 |
| e-ISBN | 9781424495320 |
| e-ISBN | 9781424495313 |
| DOI | 10.1109/ITHERM.2012.6231456 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-30 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Tin Soldering Joints Microstructure Morphology Scanning electron microscopy Twinning Lead Free Solders Reliability Thermomechanical Properties Solidification Temperature Sn Grain Morphology |
| Content Type | Text |
| Resource Type | Article |
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