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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Weibel, J.A. Kousalya, A.S. Fisher, T.S. Garimella, S.V. |
| Copyright Year | 2012 |
| Description | Author affiliation: School of Mechanical Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, USA, 47907 (Weibel, J.A.; Kousalya, A.S.; Fisher, T.S.; Garimella, S.V.) |
| Abstract | Next-generation thermal management applications will require passive heat spreading at a lower thermal resistance, higher dryout tolerance, and with thinner profile devices than current vapor chambers. Such performance improvements may be achieved by augmenting evaporation and boiling heat transfer via patterning the internal wick or nanostructuring the wick surface in the region of heat input. Test samples composed of 200 µm thick sintered copper powder layers are investigated because they can be integrated into vapor chambers with an overall thickness of 1 mm. Carbon nanotubes (CNTs) are grown onto patterned and monolithic samples by a microwave plasma chemical vapor deposition synthesis technique, and are functionalized to ensure high wettability with the test fluid, water. Performance of the test samples is evaluated in an experimental facility which replicates the heat input and capillary fluid-feeding mechanisms at the evaporator section of a vapor chamber. High-speed visualizations are performed to identify the vapor formation regimes. Monolithic samples are shown to dissipate heat fluxes greater than 400 $W/cm^{2}$ over 0.25 $cm^{2}$ prior to dryout. A noteworthy heat transfer enhancement mechanism observed is reduction of the required superheat for boiling incipience by addition of a CNT coating. Predictable transition from the evaporation to boiling regimes at a lowered superheat is critical due to the lower thermal resistance associated with boiling. Multiple repeated tests on identically prepared samples reveal that the CNT coating reduces the average incipience substrate superheat by 5.6 °C compared to uncoated samples. |
| Starting Page | 119 |
| Ending Page | 129 |
| File Size | 1542390 |
| Page Count | 11 |
| File Format | |
| ISBN | 9781424495337 |
| ISSN | 10879870 |
| e-ISBN | 9781424495320 |
| e-ISBN | 9781424495313 |
| DOI | 10.1109/ITHERM.2012.6231422 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-30 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Copper Substrates Powders Surface treatment Heat transfer Resistance heating thermal resistance vapor chamber heat pipe carbon nanotube (CNT) evaporation boiling incipience |
| Content Type | Text |
| Resource Type | Article |
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