NDLI: Thermal reliability considerations for Deployment of area array packages in harsh environments

Content Provider	IEEE Xplore Digital Library
Author	Lall, P. Naveen Singh Suhling, J. Strickland, M. Blanche, J.
Copyright Year	2004
Description	Author affiliation: Dept. of Mech. Eng., Auburn Univ., AL, USA (Lall, P.; Naveen Singh; Suhling, J.)
Abstract	Fine-Pitch BGAs and underfills have been used in benign office environments and wireless applications for a number of years, however their reliability in harsh environments is not well understood. In this work, the design guidelines development effort for deployment of fine-pitch ball-grid array packages in the harsh environments have been presented. Guidelines are targeted towards government contractors, OEMs, and 3rd party contract manufacturers who intend to select part architectures and board designs based on specified mission requirements. The guidelines are intended as an aid for understanding the sensitivity of component reliability to geometry, package architecture, material properties and board attributes in different thermal environments in order to quantitatively evaluate the impact of these parameters on the component reliability. The intent is to develop a tool for doing trade-offs between geometry, materials and quantitatively evaluating the impact on reliability. Sensitivity relations for geometry, materials, and architectures based on statistical models and failure mechanics based closed form models have been developed. Convergence between statistical model sensitivities and failure mechanics based sensitivities has been demonstrated. Predictions of sensitivities have been validated against experimental test data.
Sponsorship	Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Starting Page	259
Ending Page	267
File Size	668376
Page Count	9
File Format	PDF
ISBN	0780383575
DOI	10.1109/ITHERM.2004.1318291
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Guidelines Materials reliability Geometry Solid modeling Government Contracts Manufacturing Material properties Convergence
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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