NDLI: Package cooling designs for a dual-chip electronic package with one high power chip

Content Provider	IEEE Xplore Digital Library
Author	Arvelo, A. Toy, H. Sikka, K. Tai, A. Longworth, H. Wei Zou Coffin, J.
Copyright Year	2004
Description	Author affiliation: Thermal & Mech. Eng., IBM Microelectron., Hopewell Junction, NY, USA (Arvelo, A.; Toy, H.; Sikka, K.)
Abstract	Dual-chip microelectronic packages (DCP) with one high power chip are being increasingly encountered in computer and other electronic systems where a common chip carrier, whether a ceramic or an organic laminate, has a central processing unit (CPU) accompanied by a memory chip. In this study, package cooling designs are developed and presented for cooling two product applications of the DCP, with one application having larger power dissipation on the CPU compared to the other. Thermal analysis was conducted to identify the encapsulation solutions for the DCP. Mechanical analysis was then conducted to identify any structural integrity concerns and include appropriate verification tests during reliability assurance testing. The encapsulation processes were optimized to ensure the reliability of the package under field operation. The reliability of the packaging structures was assured using thermal measurements, acoustic sonography, and shear and tensile strength measurements of using test vehicles and actual product DCPs.
Sponsorship	Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Starting Page	23
Ending Page	33
File Size	1013432
Page Count	11
File Format	PDF
ISBN	0780383575
DOI	10.1109/ITHERM.2004.1318248
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Electronics cooling Central Processing Unit Electronic packaging thermal management Acoustic testing Application software Encapsulation Acoustic measurements Microelectronics Ceramics
Content Type	Text
Resource Type	Article

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