NDLI: Two-phase thermal management using a small-scale, heat transfer cell based on vibration-induced droplet atomization

Content Provider	IEEE Xplore Digital Library
Author	Heffington, S.N. Glezer, A.
Copyright Year	2004
Description	Author affiliation: George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Heffington, S.N.; Glezer, A.)
Abstract	A two-phase heat transfer module in which thin-film evaporation on the hot surface is achieved using surface droplet atomization is described and characterized. Surface atomization is achieved using a vibration-induced droplet atomization (VIDA) process in which small liquid droplets are produced within a sealed heat transfer cell and are propelled onto the heated surface. The VIDA technique involves the violent break-up of thin liquid layers on the vibrating surface of a piezoelectrically driven membrane that is operated at resonance. Liquid is supplied to the atomizer at a controlled rate using an integrated miniature piezoelectric pump thereby enabling orientation insensitive cell operation. The impact of the atomized droplets on the heated surface forms a thin film that evaporates continuously and the resulting vapor is condensed both on the internal surfaces of the heat transfer cell and on the surface of the atomized droplets. The condensate is collected and returned to the atomizer module by the integral diaphragm pump. The present paper describes the operation and characterization of a small-scale VIDA heat transfer module for cooling integrated circuits at the power level of desktop microprocessors. A unique element of the new cell is the addition of an internal synthetic jet that operates in the vapor space and regulates the droplet motion towards the heated surface and the transport of the vapor. Particular emphasis is placed on the cell's operating characteristics and cooling capabilities. Heat fluxes as high as 420 W/cm/sup 2/ have been realized at die temperature below 135/spl deg/C.
Sponsorship	Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Starting Page	90
Ending Page	94
File Size	403272
Page Count	5
File Format	PDF
ISBN	0780383575
DOI	10.1109/ITHERM.2004.1318261
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal management Heat transfer Atomic layer deposition Cooling Space heating Transistors Propulsion Biomembranes Resonance Piezoelectric films
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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