NDLI: Chip-scale packaging of power devices and its application in integrated power electronics modules

Content Provider	IEEE Xplore Digital Library
Author	Xingsheng Liu Xiukuan Jing Guo-Quan Lu
Copyright Year	1999
Abstract	A power electronics packaging technology utilizing chip-scale packaged (CSP) power devices to build three-dimensional (3-D) integrated power electronics modules (IPEMs) is presented in this paper. The chip-scale packaging structure, termed die dimensional ball grid array (D/sup 2/BGA), eliminates wire bonds by using stacked solder joints to interconnect power chips. D/sup 2/BGA package consists of a power chip, inner solder caps, high-lead solder balls, and molding resin. It has the same lateral dimensions as the starting power chip, which makes high-density packaging and module miniaturization possible. This package enables the power chip to combine excellent thermal transfer, high current handling capability, improved electrical characteristics, and ultralow profile packaging. Electrical tests show that the V/sub CE/(sat) and on-resistance of the D/sup 2/BGA high speed insulated-gate-bipolar transistors (IGBTs) are improved by 20% and 30% respectively by eliminating the device wirebonds and other external interconnections, such as the leadframe. In this paper, we present the design, reliability, and processing issues of D/sup 2/BGA package, and the implementation of these chip-scale packaged power devices in building 30 kW half-bridge power converter modules. The electrical and reliability test results of the packaged devices and the power modules are reported.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	206
Ending Page	215
Page Count	10
File Size	867063
File Format	PDF
ISSN	15213323
Volume Number	24
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Chip scale packaging Electronics packaging Power electronics Electronic packaging thermal management Testing Wire Soldering Resins Electric variables Cable insulation
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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