NDLI: Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning

Content Provider	IEEE Xplore Digital Library
Author	Broz, J.J. Andersen, J.C. Rincon, R.M.
Copyright Year	2000
Description	Author affiliation: Texas Instrum. Inc., Dallas, TX, USA (Broz, J.J.)
Abstract	Unstable contact resistance (C/sub RES/) during wafer test can significantly affect device yield, the need for reprobe, and equipment uptime. Abrasive cleaning during off-line probe card repair and maintenance is effective for reducing C/sub RES/ and removing surface contaminants from probe tips. This type of cleaning, however, shortens probe card life and can compromise probe card planarity and alignment. Off-line electrohydrodynamic (EHD) cleaning uses charged molecular microclusters to reduce C/sub RES/ without damaging probe card materials or misaligning the probe tips. An engineering evaluation was performed using two groups of probe cards that were regularly cleaned off-line with a tungsten carbide abrasive plate and the EHD cleaning tool respectively. For the evaluation, a very high volume device sensitive to C/sub RES/ stability and variation was identified and probe card performance was monitored for several weeks across multiple lots. Probe card performance after abrasive cleaning did not deviate significantly from the historical median. However, after EHD cleaning an increase of device yield was consistently observed. Based on the results, the EHD cleaning technique was found to be an effective addition to off-line abrasive cleaning that might have additional benefits to production.
Starting Page	477
Ending Page	484
File Size	809314
Page Count	8
File Format	PDF
ISBN	0780365461
ISSN	10893539
DOI	10.1109/TEST.2000.894240
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-10-05
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Testing Probes Cleaning Abrasives Contact resistance Surface contamination Surface resistance Electrohydrodynamics Performance evaluation Tungsten
Content Type	Text
Resource Type	Article
Subject	Applied Mathematics Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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